Semi-Conductor

Chemical mechanical polishing / planarization (cmp) is a critical manufacturing step extensively used in semiconductor fabrication for polishing semiconductor wafers or other substrates.

The polishing which selectively removes material is achieved by using chemical reaction and mechanical abrasion with slurries containing unique chemical formulations and large numbers of abrasive particles. Filtertech specializes in designing and manufacturing filtration systems using high speed centrifuges to remove slurry particulate and polishing contaminants to reduce the cost of waste water treatment. The custom designed systems include tanks, pumps and controls.